3D Finite Element Model using SIBC to Accelerate Electromagnetic Thermal Simulation of Induction Thermography Technique - Nantes Université Access content directly
Conference Papers Year : 2019

3D Finite Element Model using SIBC to Accelerate Electromagnetic Thermal Simulation of Induction Thermography Technique

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hal-03554046 , version 1 (03-06-2022)

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Didier Trichet, Abdoulaye Ba, H.K. Bui, Gerard Berthiau, Guillaume Wasselynck. 3D Finite Element Model using SIBC to Accelerate Electromagnetic Thermal Simulation of Induction Thermography Technique. 2019 19th International Symposium on Electromagnetic Fields in Mechatronics, Electrical and Electronic Engineering (ISEF), Aug 2019, Nancy, France. pp.1-2, ⟨10.1109/ISEF45929.2019.9097101⟩. ⟨hal-03554046⟩
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